PEEK wafer clamp
PEEK wafer clamp

PEEK wafer clamp

Wafer holding tool PEEK wafer clamp, a tool for handheld inspection of wafers. PEEK does not contain halogen elements and does not contaminate semiconductor wafers. PEEK wafer clamps and silicon wafer tweezers can be used for a long time at a temperature of 260°C. They can maintain high strength at high temperatures, have good dimensional stability, and a small linear expansion coefficient. At the same time, they have excellent properties such as resistance to sliding wear and fretting wear, and a low friction coefficient. When using PEEK wafer clamps to clamp wafers and silicon wafers, no scratches will be caused on the surface of the wafers and silicon wafers, and no residue will be produced on the wafers and silicon...

Wafer holding tool PEEK wafer clamp, a tool for handheld inspection of wafers. PEEK does not contain halogen elements and does not contaminate semiconductor wafers.

PEEK wafer clamps and silicon wafer tweezers can be used for a long time at a temperature of 260°C. They can maintain high strength at high temperatures, have good dimensional stability, and a small linear expansion coefficient. At the same time, they have excellent properties such as resistance to sliding wear and fretting wear, and a low friction coefficient. When using PEEK wafer clamps to clamp wafers and silicon wafers, no scratches will be caused on the surface of the wafers and silicon wafers, and no residue will be produced on the wafers and silicon wafers due to friction, thereby improving the surface cleanliness of the wafers and silicon wafers.

PEEK polymer is a high-performance thermoplastic, its excellent comprehensive performance is specially designed to meet the increasing requirements of the electronics industry.
1. High temperature resistance : With heat resistance up to 320℃, it can maintain its strength and dimensional stability at high temperatures of lead-free soldering process, and will not deform with reflow within 5-10 seconds at 250-280℃;
2. Wear resistance : High mechanical strength and wear resistance;
3. Dimensional stability : Filler-grade materials reduce the coefficient of thermal expansion and increase the heat deformation temperature, which can ensure strict dimensional control;
4. Low outgassing : Reduces contamination and improves the reliability of accessories in applications with purity requirements (such as hard disk drives, wafer boxes);
5. Low hygroscopicity : It is very important to maintain dimensional stability and insulation performance.

 

 

 

 

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