PPS CMP retaining ring

As an important stage in the semiconductor manufacturing process, chemical mechanical polishing (CMP) requires strict process control, strict tolerances and high-quality surface shape and plane. The miniaturization of products and electronic devices has further put forward higher requirements for process performance, and thus the requirements for the performance of the retaining ring assembly (a key component of the CMP process) are also getting higher and higher. Reasonable material selection and design of the CMP retaining ring can ensure that the wafer has a low polishing rate, strict plane tolerance and low vibration properties during the processing.

Features and advantages:
High dimensional stability, able to maintain modulus under high temperature conditions, providing higher process performance and product performance.
Easy to process.
Good mechanical properties, suitable for applications requiring impact resistance, rapid equipment assembly, robot speed and stable product quality.
Good chemical corrosion resistance, able to withstand corrosion from most chemicals, beneficial for protecting parts and extending tool life.
Good wear resistance.
Can reduce overall system costs, and has proven to pay back on investment.